IP Library › Assignment 021259/0619
Patent Assignment
Reel/Frame 021259/0619

Assignment of Assignor's Interest

Recorded: 2008-07-18 Pages: 2
Assignors
UTSUMI, MASAKI
Executed: 2008-03-14
TAKATA, TAKASHI
Executed: 2008-03-14
IIDAKA, MASAHIRO
Executed: 2008-03-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Circuit Substrate, Molding Semiconductor Device, Tray and Inspection Socket
Patent: 7,777,311 →
Application: 12/056,378 →
Publication: US 2008/0283985
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 3, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021779/0851 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →