Patent Assignment
Reel/Frame 021307/0113
Assignment of Assignor's Interest
Recorded: 2008-07-21
Pages: 4
Assignors
KANEMARU, YOSHIKAZU
Executed: 2008-07-02
MORITA, TAKAAKI
Executed: 2008-07-02
KAWABATA, KENICHI
Executed: 2008-07-04
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN
Covered Property
(1)
Electronic Component-Embedded Board and Method of Manufacturing the Same