Patent Assignment
Reel/Frame 021309/0517
Assignment of Assignor's Interest
Recorded: 2008-07-29
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2008-07-21
LIN, HUNG-TA
Executed: 2008-07-28
CHEN, DING-YUAN
Executed: 2008-07-21
CHIOU, WEN-CHIH
Executed: 2008-07-21
YU, CHIA-LIN
Executed: 2008-07-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Stress-Alleviation Layer for Led Structures