Patent Assignment
Reel/Frame 021322/0224
Assignment of Assignor's Interest
Recorded: 2008-07-31
Pages: 7
Assignors
KOYATA, SAKAE
Executed: 2008-07-11
HASHII, TOMOHIRO
Executed: 2008-07-07
MURAYAMA, KATSUHIKO
Executed: 2008-07-07
TAKAISHI, KAZUSHIGE
Executed: 2008-07-07
KATOH, TAKEO
Executed: 2008-07-07
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Method for Etching Single Wafer