Assignment of Assignor's Interest

Recorded: 2008-08-04 Pages: 3

Assignors

CHO, SE-HOON

Executed: 2008-07-01

KIM, JEUNG-IL

Executed: 2008-07-01

LEE, SANG-MOO

Executed: 2008-07-01

Assignee

SAMSUNG TECHWIN CO., LTD.

28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF

Covered Property (1)

Lead Frame, Semiconductor Package Including the Lead Frame and Method of Forming the Lead Frame

Patent: 7,952,175 →

Application: 12/217,195 →

Publication: US 2009/0014854

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.