IP Library › Assignment 021343/0689
Patent Assignment
Reel/Frame 021343/0689

Assignment of Assignor's Interest

Recorded: 2008-08-06 Pages: 2
Assignors
KAGAYA, YUTAKA
Executed: 2008-07-23
WATANABE, FUMITOMO
Executed: 2008-07-23
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Semiconductor Device Including a Semiconductor Chip Which Is Mounted Spaning a Plurality of Wiring Boards and Manufacturing Method Thereof
Patent: 7,888,179 →
Application: 12/186,056 →
Publication: US 2009/0039506
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →