Patent Assignment
Reel/Frame 021348/0103
Assignment of Assignor's Interest
Recorded: 2008-08-06
Pages: 3
Assignors
CHAPMAN, PHILLIP F.
Executed: 2008-07-28
COLLINS, DAVID S.
Executed: 2008-07-28
VOLDMAN, STEVEN H.
Executed: 2008-07-17
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structure and Method of Latchup Robustness with Placement of Through Wafer via Within Cmos Circuitry