IP Library › Assignment 021353/0770
Patent Assignment
Reel/Frame 021353/0770

Assignment of Assignor's Interest

Recorded: 2008-08-07 Pages: 2
Assignors
SHINADA, EIICHI
Executed: 2008-06-23
KATOU, MASAHIRO
Executed: 2008-06-23
WATANABE, NORIAKI
Executed: 2008-06-23
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0449, JAPAN
Covered Property (1)
Method for Manufacturing Multilayer Wiring Board
Patent: 7,870,663 →
Application: 12/278,606 →
Publication: US 2009/0007425
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 9, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059355/0743 →
Demerger Jun 14, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 060281/0643 →