Patent Assignment
Reel/Frame 021353/0839
Assignment of Assignor's Interest
Recorded: 2008-08-07
Pages: 2
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO,, HAMAMATSU-SHI, SHIZUOKA, 435-8558, JAPAN
Covered Property
(1)
Laser Processing Method for Cutting Substrate and Laminate Part Bonded to the Substrate