Patent Assignment
Reel/Frame 021359/0616
Assignment of Assignor's Interest
Recorded: 2008-08-08
Pages: 8
Assignors
ANDERSON, FELIX P.
Executed: 2008-08-05
COTE, WILLIAM
Executed: 2008-08-06
EDELSTEIN, DANIEL C.
Executed: 2008-08-06
MCDEVITT, THOMAS L.
Executed: 2008-08-05
STAMPER, ANTHONY K.
Executed: 2008-08-04
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.