Patent Assignment
Reel/Frame 021363/0223
Assignment of Assignor's Interest
Recorded: 2008-08-08
Pages: 3
Assignor
IIZUKA, HIROHISA
Executed: 2008-08-04
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same