IP Library Assignment 021367/0488
Patent Assignment
Reel/Frame 021367/0488

Assignment of Assignor's Interest

Recorded: 2008-08-11 Pages: 4
Assignors
ISHII, FUSAO
Executed: 2007-11-25
ICHIKAWA, HIROTOSHI
Executed: 2007-11-26
Assignees
SILICON QUEST KABUSHIKI-KAISHA
1588-128 KOSHIGOE KAMAKURA-SHI, KANAGAWA-KEN, 248-0033, JAPAN
OLYMPUS CORPORATION
SHINJUKUMONOLITH, 3-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0914, JAPAN
Covered Property (1)
Method for Aligning Die to Substrate
Patent: 7,848,002 →
Application: 12/004,621 →
Publication: US 2008/0212162