Patent Assignment
Reel/Frame 021369/0282
Assignment of Assignor's Interest
Recorded: 2008-08-11
Pages: 5
Assignors
SHI, XUNQING
Executed: 2008-05-07
MA, WEI
Executed: 2008-05-07
XIE, BIN
Executed: 2008-05-07
CHUNG, CHANG HWA
Executed: 2008-05-07
Assignee
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.
3RD FLOOR, BIO-INFORMATICS CENTRE, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES, HONG KONG
Covered Property
(1)
Pulse-Laser Bonding Method for Through-Silicon-via Based Stacking of Electronic Components