IP Library Assignment 021388/0297
Patent Assignment
Reel/Frame 021388/0297

Assignment of Assignor's Interest

Recorded: 2008-08-07 Pages: 4
Assignors
MAEDA, TAKAHIRO
Executed: 2008-06-16
MAEDA, KIYOHIKO
Executed: 2008-06-16
OZAKI, TAKASHI
Executed: 2008-06-16
YOSHINO, AKIHITO
Executed: 2008-06-16
KOSHI, YASUNOBU
Executed: 2008-06-30
URANO, YUJI
Executed: 2008-06-16
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property (1)
Manufacturing Method of Semiconductor Device and Substrate Processing Apparatus
Patent: 8,304,328 →
Application: 12/223,718 →
Publication: US 2009/0087964
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →