Patent Assignment
Reel/Frame 021394/0681
Assignment of Assignor's Interest
Recorded: 2008-08-15
Pages: 3
Assignors
MIZUNO, YASUYUKI
Executed: 2008-06-10
FUJIMOTO, DAISUKE
Executed: 2008-06-10
DANJOBARA, KAZUTOSHI
Executed: 2008-06-10
MURAI, HIKARI
Executed: 2008-06-10
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →