Patent Assignment
Reel/Frame 021407/0502
Assignment of Assignor's Interest
Recorded: 2008-07-30
Pages: 3
Assignors
CHIANG, CHIANG-CHENG
Executed: 2008-07-19
HUANG, CHIEN-PING
Executed: 2008-07-19
CHANG, CHIN-HUANG
Executed: 2008-07-19
CHIU, CHI-HSIN
Executed: 2008-07-19
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG RD., TANTZU, TAICHUNG, ROC, TAIWAN
Covered Property
(1)
Multi-chip stack structure having through silicon via and method for fabrication the same
Application:
12/220,995 →
Publication:
US 2009/0032928
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.