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App. No. 12/220,995 · Confirmation No. 9236

Multi-chip stack structure having through silicon via and method for fabrication the same

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2011-09-14 ABN Abandonment 2 View
2011-03-02 CTNF Non-Final Rejection 12 View
2011-03-02 892 List of references cited by examiner 1 View
2011-03-02 FWCLM Index of Claims 1 View
2011-03-02 SRFW Search information including classification, databases and other search related notes 1 View
2011-03-02 SRNT Examiner's search strategy and results 2 View
2011-03-02 1449 List of References cited by applicant and considered by examiner 2 View
2011-03-02 BIB Bibliographic Data Sheet 1 View
2010-12-10 ELC. Response to Election / Restriction Filed 1 View
2010-12-10 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2010-12-10 N417 Electronic Filing System Acknowledgment Receipt 2 View
2010-11-22 CTRS Requirement for Restriction/Election 10 View
2010-11-22 FWCLM Index of Claims 1 View
2009-02-05 NTC.PUB Notice of Publication 1 View
2008-10-21 FRPR Certified Copy of Foreign Priority Application 33 View
2008-08-22 APP.FILE.REC Filing Receipt 3 View
2008-07-30 TRNA Transmittal of New Application 3 View
2008-07-30 ADS Application Data Sheet 3 View
2008-07-30 SPEC Specification 12 View
2008-07-30 CLM Claims 6 View
2008-07-30 ABST Abstract 1 View
2008-07-30 DRW Drawings-only black and white line drawings 6 View
2008-07-30 OATH Oath or Declaration filed 2 View
2008-07-30 TRAN.LET Transmittal Letter 2 View
2008-07-30 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2008-07-30 WFEE Fee Worksheet (SB06) 1 View
2008-07-30 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
12/220,995
Filed
2008-07-30
Pub. No.
US20090032928A1
Art Unit
2815