Patent Assignment
Reel/Frame 021418/0347
Assignment of Assignor's Interest
Recorded: 2008-08-20
Pages: 4
Assignors
RYU, JIN MUN
Executed: 2008-08-04
LEE, JUNG SEOK
Executed: 2008-08-04
PARK, HYUNG KYU
Executed: 2008-08-04
KIM, BO KYOUNG
Executed: 2008-08-04
WOO, YUN SEOK
Executed: 2008-08-05
KIM, JUNG JIN
Executed: 2008-08-04
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON-SI, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Glass Cap Molding Package, Manufacturing Method Thereof and Camera Module