Patent Assignment
Reel/Frame 021418/0390
Assignment of Assignor's Interest
Recorded: 2008-08-20
Pages: 5
Assignors
LEE, BYOUNG HWA
Executed: 2008-06-26
WI, SUNG KWON
Executed: 2008-06-26
CHUNG, HAE SUK
Executed: 2008-06-26
PARK, DONG SEOK
Executed: 2008-06-26
PARK, SANG SOO
Executed: 2008-06-26
PARK, MIN CHEOL
Executed: 2008-06-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, REPUBLIC OF KOREA, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor and Circuit Board Device Including the Same