Patent Assignment
Reel/Frame 021433/0288
Assignment of Assignor's Interest
Recorded: 2008-08-25
Pages: 2
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Resin Sealed Semiconductor Device and Manufacturing Method Therefor