Assignment of Assignor's Interest

Recorded: 2008-08-26 Pages: 21

Assignor

CUBIC WAFER, INC.

Executed: 2008-03-21

Assignee

CUFER ASSET LTD. L.L.C.

1209 ORANGE STREET, WILMINGTON, DELAWARE, 19801

Covered Property (1)

Optical Chip Packaging via Through Hole

Patent: 6,613,597 →

Application: 10/183,847 →

Publication: US 2003/0026553

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.