Patent Assignment
Reel/Frame 021467/0028
Assignment of Assignor's Interest
Recorded: 2008-09-02
Pages: 3
Assignor
STACK, RICHARD
Executed: 2008-03-14
Assignee
CUBIC WAFER, INC.
10 AL PAUL LANE, MERRIMACK, NEW HAMPSHIRE, 03054
Covered Property
(1)
Optical Chip Packaging via Through Hole
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.