Assignment of Assignor's Interest

Recorded: 2008-08-21 Pages: 3

Assignors

KAWAMURA, TOSHINORI

Executed: 2008-07-22

AKAHOSHI, HARUO

Executed: 2008-07-22

ARAI, KUNIO

Executed: 2008-07-17

Assignee

HITACHI VIA MECHANICS, LTD.

2100 KAMI-IMAIZUMI EBINA-SHI, KANAGAWA, JAPAN

Covered Property (1)

Method for Manufacturing Printed Wiring Board and Electrolytic Etching Solution for Use in the Manufacturing Method

Patent: 8,366,903 →

Application: 12/222,995 →

Publication: US 2009/0084684

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.