IP Library › Assignment 021481/0018
Patent Assignment
Reel/Frame 021481/0018

Assignment of Assignor's Interest

Recorded: 2008-09-04 Pages: 5
Assignors
LEE, SEON GOO
Executed: 2008-08-08
RYO, GEUN CHANG
Executed: 2008-08-08
LEE, DONG YEOUL
Executed: 2008-08-08
KIM, YONG TAE
Executed: 2008-08-08
SONG, YOUNG JAE
Executed: 2008-08-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Method of Manufacturing Led Package for Formation of Molding Member
Patent: 8,202,746 →
Application: 12/204,049 →
Publication: US 2009/0087931
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →