IP Library › Assignment 021495/0153
Patent Assignment
Reel/Frame 021495/0153

Assignment of Assignor's Interest

Recorded: 2008-09-08 Pages: 3
Assignor
TANAKA, HIRONORI
Executed: 2008-08-20
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property (1)
Multilayer Printed Wiring Board with a Built-in Capacitor
Patent: 8,115,113 →
Application: 12/216,747 →
Publication: US 2009/0139760