Patent Assignment
Reel/Frame 021496/0689
Assignment of Assignor's Interest
Recorded: 2008-09-08
Pages: 5
Assignors
HSU, KUO-CHING
Executed: 2008-08-06
CHEN, CHEN-SHIEN
Executed: 2008-08-06
SU, BOE
Executed: 2008-08-06
HUANG, HON-LIN
Executed: 2008-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Introducing a Metal Layer Between Sin and Tin to Improve Cbd Contact Resistance for P-Tsv