Patent Assignment
Reel/Frame 021510/0117
Assignment of Assignor's Interest
Recorded: 2008-09-04
Pages: 4
Assignee
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO 120-8555, JAPAN
Covered Property
(1)
Process for Producing a Solder Preform Having High-Melting Metal Particles Dispersed Therein