IP Library › Assignment 021524/0236
Patent Assignment
Reel/Frame 021524/0236

Assignment of Assignor's Interest

Recorded: 2008-09-09 Pages: 2
Assignors
HONG, KI-SUNG
Executed: 2008-08-04
PARK, IN-KYU
Executed: 2008-08-04
BYUN, BO-HYUN
Executed: 2008-08-04
Assignee
SAMSUNG SDI CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA
575 SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Protective Circuit Board Having Groove and Battery Pack Using the Same
Patent: 8,228,033 →
Application: 12/222,515 →
Publication: US 2009/0085518