IP Library Assignment 021532/0930
Patent Assignment
Reel/Frame 021532/0930

Assignment of Assignor's Interest

Recorded: 2008-09-03 Pages: 3
Assignor
IWAKI, TAKAYUKI
Executed: 2008-08-25
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Apparatus Including Semiconductor Chip with Stress Material Selectively Provided in Region of Wiring Layer
Patent: 7,956,461 →
Application: 12/230,684 →
Publication: US 2009/0057893
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0687 →