Patent Assignment
Reel/Frame 021532/0938
Assignment of Assignor's Interest
Recorded: 2008-09-03
Pages: 5
Assignors
HONG, YONG-SUNG
Executed: 2008-07-23
PARK, JONG-YOON
Executed: 2008-09-03
PARK, HYUN-JOON
Executed: 2008-07-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Polishing Carrier Apparatus and Chemical Mechanical Polishing Equipment Using the Same