Patent Assignment
Reel/Frame 021543/0497
Assignment of Assignor's Interest
Recorded: 2008-09-17
Pages: 3
Assignor
HASEGAWA, TSUYOSHI
Executed: 2008-08-05
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Heat Dissipation Plate and Semiconductor Device