Patent Assignment
Reel/Frame 021545/0828
Assignment of Assignor's Interest
Recorded: 2008-09-15
Pages: 9
Assignors
POON, DEBORA CHYIU HYIA
Executed: 2008-06-20
SEE, ALEX KH
Executed: 2008-06-20
BENISTANT FRANCIS
Executed: 2008-06-20
COLOMBEAU, BENJAMIN
Executed: 2008-06-30
TAN, YUN LING
Executed: 2008-06-17
ZHOU, MEI SHENG
Executed: 2008-06-20
HSIA, LIANG CHOO
Executed: 2008-06-20
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
60 WOODLANDS INDUSTRIAL PARK D, STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Method and Apparatus to Reduce Thermal Variations Within an Integrated Circuit Die Using Thermal Proximity Correction
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 2, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 024476/0268 →
Change of Name
Jun 2, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 024476/0275 →
Security Agreement
Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →