Patent Assignment
Reel/Frame 021545/0878
Assignment of Assignor's Interest
Recorded: 2008-09-17
Pages: 3
Assignors
SONG, IN-SANG
Executed: 2008-08-11
KANG, IN-KU
Executed: 2008-08-13
KIM, KYUNG-MAN
Executed: 2008-08-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same