Patent Assignment
Reel/Frame 021554/0379
Assignment of Assignor's Interest
Recorded: 2008-09-08
Pages: 2
Assignor
TANAKA, YASUO
Executed: 2006-09-11
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105-8460, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Having an Intermetallic Terminal Pad and Solder Junction Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.