Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

1. A method for manufacturing a semiconductor device, comprising:

providing disposing a Zn system material directly on a copper terminal pad formed over an underlying base;

disposing a Pb-free solder ball over the Zn system material; and

performing a heating process for reflowing the Pb-free solder ball to thereby form a reactive product layer constituted of a component of the copper terminal pad and a component of the Zn system material between the copper terminal pad and the Pb-free solder ball.

2. The method according to claim 1 , wherein providing the Zn system material directly on the copper terminal pad is accomplished by printing, and wherein disposing the Pb-free solder ball over the Zn system material is accomplished by mounting.

3. The method according to claim 2 , wherein the Zn system material has a thickness ranging from 10 μm to 60 μm.

4. The method according to claim 1 , wherein providing the Zn system material directly on the copper terminal pad is accomplished by plating, wherein disposing the Pb-free solder ball over the Zn system material is accomplished by printing a Pb-free solder paste thereon; and wherein performing the heating process for reflowing reflows the Pb-free solder paste to thereby form said reactive product layer.

5. The method according to claim 4 , wherein the Zn system material has a thickness ranging from 0.1 μm to 5 μm.

6. The method according to claim 1 , wherein the reactive product layer is an intermetallic reactive product that is a Cu—Zn reactive product.