Patent Assignment
Reel/Frame 021567/0306
Assignment of Assignor's Interest
Recorded: 2008-09-11
Pages: 3
Assignors
CHOI, JUNG-DAL
Executed: 2008-09-09
PARK, YOUNG-WOO
Executed: 2008-09-09
PARK, JIN-TAEK
Executed: 2008-09-09
HYUN, CHUNG-IL
Executed: 2008-09-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same