Patent Assignment
Reel/Frame 021570/0022
Assignment of Assignor's Interest
Recorded: 2008-09-23
Pages: 4
Assignor
NEXX SYSTEMS, INC.
Executed: 2008-09-04
Assignee
SEMIGEAR, INC.
107 AUDUBON ROAD, SUITE 2, BUILDING 1, WAKEFIELD, MASSACHUSETTS, 01880
Covered Property
(1)
Disk Furnace for Thermal Processing
Patent:
6,234,788 →
Application:
09/433,859 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 3, 2000
From: LEE, CHUNGHSIN
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 010720/0453 →
Corrective Assignment to Correct the State of Incorporation of the Assignee, Previously Recorded on Reel 010720 Frame 0453, Assignor Confirms the Assignment of the Entire Interest.
Sep 10, 2001
From: LEE, CHUNGHSIN
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012148/0027 →
Assignment of Assignor's Interest
Oct 1, 2001
From: MKS INSTRUMENTS, INC.; APPLIED SCIENCE AND TECHNOLOGY, INC.
To: NEXX SYSTEMS PACKAGING, LLC
Reel/Frame 012211/0008 →
Security Agreement
Nov 4, 2004
From: NEXX SYSTEMS, INC.
To: ENTERPRISE PARTNERS VI, L.P., AS COLLATERAL AGENT
Reel/Frame 015328/0752 →
Security Agreement
Nov 5, 2004
From: NEXX SYSTEMS PACKAGING, LLC
To: ENTERPRISE PARTNERS VI, L.P.; ENTERPRISE PARTNERS V, L.P.; POST, RICHARD S.
Reel/Frame 015334/0079 →
Assignment of Assignor's Interest
Apr 21, 2006
From: NEXX SYSTEMS PACKAGING LLC
To: NEXX SYSTEMS, INC.
Reel/Frame 017507/0280 →
Assignment of Assignor's Interest
Nov 5, 2007
From: NEXX SYSTEMS, INC.
To: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
Reel/Frame 020064/0111 →