Patent Assignment
Reel/Frame 021573/0864
Assignment of Assignor's Interest
Recorded: 2008-09-23
Pages: 3
Assignors
KUO, YIAN-LIANG
Executed: 2008-09-15
CHEN, CHIEN-YI
Executed: 2008-09-18
LIN, YU-TING
Executed: 2008-09-15
HUANG, YUNG-SHENG
Executed: 2008-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Protecting Sidewalls of Semiconductor Chips Using Insulation Films