Patent Assignment
Reel/Frame 021590/0303
Security Agreement
Recorded: 2008-09-26
Pages: 2
Assignor
HI-TECH WELDING AND FORMING, INC.
Executed: 2008-09-25
Assignee
THE BOEING COMPANY
100 N. RIVERSIDE PLAZA, CHICAGO, ILLINOIS, 60606-1501
Covered Properties
(2)
Superplastic Metalforming with Self-Contained Die
Patent:
5,823,034 →
Application:
08/948,678 →
Die Apparatus and Method for High Temperature Forming of Metal Products
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 13, 1998
From: NELEPOVITZ, DONALD O.
To: HYPERFORM TECHNOLOGIES, INC.
Reel/Frame 009309/0926 →
Assignment of Assignor's Interest
Aug 18, 2005
From: MONSEES, JOHN C.; NELEPOVITZ, DONALD O.
To: HI-TECH WELDING SERVICES
Reel/Frame 016909/0986 →
Change of Name
Aug 24, 2006
From: H-TECH WELDING SERVICES, INC.
To: HI-TECH WELDING AND FORMING, INC.
Reel/Frame 018167/0281 →
Change of Name
Jun 17, 2008
From: HI-TECH WELDING SERVICES, INC.
To: HI-TECH WELDING AND FORMING, INC.
Reel/Frame 021096/0965 →
Assignment of Assignor's Interest
Jun 17, 2008
From: HYPERFORM TECHNOLOGIES, INC.
To: HI-TECH WELDING SERVICES, INC.
Reel/Frame 021096/0852 →
Assignment of Assignor's Interest
Apr 12, 2013
From: HI-TECH WELDING AND FORMING, INC.
To: SAN DIEGO WELDING AND FORMING, INC.
Reel/Frame 030205/0702 →
Release of Security Interest
May 16, 2013
From: THE BOEING COMPANY
To: HI-TECH WELDING AND FORMING, INC.
Reel/Frame 030428/0192 →
Assignment of Assignor's Interest
May 23, 2013
From: SAN DIEGO WELDING AND FORMING, INC.
To: VERTECHS ENTERPRISES, INC.
Reel/Frame 030478/0890 →