Patent Assignment
Reel/Frame 021591/0555
Assignment of Assignor's Interest
Recorded: 2008-09-19
Pages: 6
Assignors
HAYASHIDA, AKIRA
Executed: 2008-08-28
UENO, MASAAK
Executed: 2008-08-28
SHIMADA, MASAKAZU
Executed: 2008-08-28
SUGISHITA, MASASHI
Executed: 2008-08-28
MIYATA, TOSHIMITSU
Executed: 2008-08-29
KITAMURA, KIMIO
Executed: 2008-08-18
TANAKA, KENJI
Executed: 2008-08-18
NISHIHARA, JYUNICHI
Executed: 2008-08-22
Assignees
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO, 101-8980, JAPAN
TEITOKUSHA CO., LTD.
1-5-32, SHIGITA, JOTO-KU, OSAKA-SHI, OSAKA, JAPAN
Covered Property
(1)
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Request to Correct the Second Inventor's First Name to an Assignment Document Previously Recorded at Reel 021591 Frame 0555
Oct 21, 2008
From: HAYASHIDA, AKIRA; UENO, MASAAKI; SHIMADA, MASAKAZU; SUGISHITA, MASASHI
To: HITACHI KOKUSAI ELECTRIC INC.; TEITOKUSHA CO., LTD.
Reel/Frame 021708/0533 →
Assignment of Assignor's Interest
Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →