IP Library › Assignment 021592/0157
Patent Assignment
Reel/Frame 021592/0157

Assignment of Assignor's Interest

Recorded: 2008-09-26 Pages: 3
Assignors
SHIN, SANG HYUN
Executed: 2008-08-26
CHOI, SEOG MOON
Executed: 2008-08-26
LEE, YOUNG KI
Executed: 2008-08-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTON-GU,, SUWON GYUNGGI DO, 443-743, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package and Method of Manufacturing the Same
Patent: 8,610,146 →
Application: 12/238,663 →
Publication: US 2010/0032705
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →