IP Library › Assignment 021624/0691
Patent Assignment
Reel/Frame 021624/0691

Assignment of Assignor's Interest

Recorded: 2008-10-02 Pages: 3
Assignors
PARK, JUNG KYU
Executed: 2008-08-18
JOO, SEONG AH
Executed: 2008-08-18
CHOI, SEUNG HWAN
Executed: 2008-08-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Substrate Module and Method of Manufacturing the Same, and Backlight Unit and Method of Manufacturing the Same
Patent: 8,132,953 →
Application: 12/244,393 →
Publication: US 2009/0161343
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →