Patent Assignment
Reel/Frame 021635/0937
Assignment of Assignor's Interest
Recorded: 2008-10-06
Pages: 2
Assignor
MOTOMURO, HIROSHI
Executed: 2008-09-30
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing an Electronic Component Substrate