Method of manufacturing an electronic component substrate

1. A method of manufacturing an electronic component substrate in which a plurality of electronic components are mounted on a first substrate, the method comprising:

aligning and disposing the plurality of electronic components on a second substrate;

transferring the electronic components on the second substrate onto the first substrate;

detecting an electronic component unmounted portion on the first substrate; and

repairing by selectively re-transferring the electronic component from the second substrate onto the detected un-mounted portion on the first substrate.

2. The method of manufacturing an electronic component substrate according to claim 1 , wherein repairing step includes:

disposing the electronic components onto the second substrate with a resin film therebetween;

disposing the first substrate and the second substrate to face each other such that the electronic components on the first substrate and the electronic components on the second substrate face each other;

aligning a mounting mechanism at a position corresponding to the un-mounted portion based on detection data of the un-mounted portion; and

selectively re-transferring the electronic component onto the un-mounted portion by the electronic component on the second substrate being pressed onto the first substrate with the resin film in between by the mounting mechanism.

3. The method of manufacturing an electronic component substrate according to claim 1 , wherein, before transferring step, the un-mounted portion is indirectly detected by a deficient portion on the second substrate being detected, the deficient portion being a portion at which the electronic component is not originally disposed.

4. The method of manufacturing an electronic component substrate according to claim 3 , wherein the deficient portion on the second substrate is detected by image data being acquired by the electronic components on the second substrate being imaged.

5. The method of manufacturing an electronic component substrate according to claim 3 , wherein the deficient portion on the second substrate is detected by displacement data being acquired by displacement on a front surface of the second substrate being inspected.

6. The method of manufacturing an electronic component substrate according to claim 1 , wherein, after transferring step, the unmounted portion is detected by a mounting defect portion on the second substrate being detected, the mounting defect portion being a portion at which the electronic component remains without being transferred.

7. The method of manufacturing an electronic component substrate according to claim 6 , wherein the mounting defect portion on the second substrate is detected by image data being acquired by the electronic components on the second substrate being imaged.

8. The method of manufacturing an electronic component substrate according to claim 6 , wherein the mounting defect portion on the second substrate is detected by displacement data being acquired by displacement on a front surface of the second substrate being inspected.

9. The method of manufacturing an electronic component substrate according to claim 1 , wherein, after transferring step, the unmounted portion on the first substrate is directly detected.

10. The method of manufacturing an electronic component substrate according to claim 9 , wherein the unmounted portion of the first substrate is directly detected by image data being acquired by the electronic components on the first substrate being imaged.

11. The method of manufacturing an electronic component substrate according to claim 10 , wherein the electronic component substrate is a light emitting device substrate formed by the electronic components being configured by light emitting devices having an outer appearance that is black in color, and

regions of the light emitting device substrate other than the light emitting devices are configured by a black matrix layer.

12. The method of manufacturing an electronic component substrate according to claim 1 , wherein the electronic component substrate is a light emitting device substrate formed by the electronic components being configured by light emitting devices.

13. The method of manufacturing an electronic component substrate according to claim 12 , wherein the light emitting device substrate is a light emitting diode substrate formed by the light emitting devices being configured by light emitting diodes.