Patent Assignment
Reel/Frame 021671/0141
Assignment of Assignor's Interest
Recorded: 2008-10-12
Pages: 4
Assignor
KIM, MYUNG-SOO
Executed: 2008-10-08
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device Including Implanting Through a Hole Patterned from a First Photoresist an Oxide and a Second Photoresist
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.