Patent Assignment
Reel/Frame 021683/0133
Assignment of Assignor's Interest
Recorded: 2008-10-15
Pages: 2
Assignor
KIM, HYE-JIN
Executed: 2008-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Module, System Having Solder Ball Coupled to Chip Pad and Manufacturing Method Thereof