IP Library › Assignment 021702/0288
Patent Assignment
Reel/Frame 021702/0288

Assignment of Assignor's Interest

Recorded: 2008-10-01 Pages: 2
Assignors
LEE, YOUNG-KI
Executed: 2008-08-18
CHOI, SEOG-MOON
Executed: 2008-08-18
JEON, HYUNG-JIN
Executed: 2008-08-18
SHIN, SANG-HYUN
Executed: 2008-08-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property (1)
Sub-Mount, Light Emitting Diode Package and Manufacturing Method Thereof
Patent: 7,960,806 →
Application: 12/285,324 →
Publication: US 2009/0261356
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →