Patent Assignment
Reel/Frame 021703/0901
Assignment of Assignor's Interest
Recorded: 2008-10-02
Pages: 4
Assignor
UCHIDA, SHINICHI
Executed: 2008-09-26
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having High Frequency Wiring and Dummy Metal Layer at Multilayer Wiring Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.