Patent Assignment
Reel/Frame 025214/0175
Change of Name
Recorded: 2010-10-28
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Decode Device, Reproduction Apparatus, and Method for Decoding
Semiconductor Device
Semiconductor Storage Device Comprising Reference Cell Discharge Operation Load Reduction
Mb-Ofdm Receiver That Weights a Quality of Each Subcarrier
Semiconductor Device with Ddr Memory Controller
Semiconductor Integrated Circuit Having Dram Word Line Drivers
Flip-Chip Type Semiconductor Device
Semiconductor Storage Device and Method of Controlling the Same
Method of Manufacturing Optical Module and Method of Manufacturing Optical Transceiver
Application:
12/258,769 →
Publication:
US 2009/0129727
Semiconductor Integrated Circuit
Semiconductor Device
Application:
12/263,650 →
Publication:
US 2009/0115022
Optical Semiconductor Relay Device for Reducing Transient Voltage Between Output Terminals of the Relay and Maintaining High Operation Speed and Low Capacitance Characteristics
Signal Processing Apparatus
Test Circuit
Application:
12/266,141 →
Publication:
US 2009/0132883
Image Processing Device
Semiconductor Device and Method for Manufacturing the Same
Application:
12/269,300 →
Publication:
US 2009/0127707
Semiconductor Integrated Circuit Device
Application:
12/270,469 →
Publication:
US 2009/0127721
Process for Forming a Pattern Including on a Semiconductor Device
Application:
12/272,221 →
Publication:
US 2009/0075482
Nonvolatile Semiconductor Memory Device and Method of Writing Data into the Same
Process for Manufacturing Semiconductor Device
Compact Wideband Antenna
Application:
12/278,823 →
Publication:
US 2009/0303136
Variation Simulation System, Method for Determining Variations, Apparatus for Determining Variations and Program
Application:
12/278,884 →
Publication:
US 2010/0217568
Small-Size Wide Band Antenna and Radio Communication Device
Semiconductor Device and Manufacturing Method Thereof
Broadband Transition from a via Interconnection to a Planar Transmission Line in a Multilayer Substrate
Optical Disc Device and Defect Detection Method for Optical Disc Medium
Data processing apparatus and access control method therefor
Application:
12/285,078 →
Publication:
US 2009/0271861
Semiconductor Integrated Circuit Device Having Control Circuit to Selectively Activate Decoupling Cells
Semiconductor integrated circuit having output buffer circuit
Application:
12/285,088 →
Publication:
US 2009/0085068
Semiconductor Integrated Circuit Device Including Static Random Access Memory Having Diffusion Layers for Supplying Potential to Well Region
Nonvolatile Semiconductor Memory and Method of Manufacturing the Same
Optical Disc Reproducing Apparatus and Operation Method Thereof
Method and apparatus for circuit simulation in view of stress exerted on MOS transistor
Application:
12/285,215 →
Publication:
US 2009/0089037
Autofocus control circuit, autofocus control method and image pickup apparatus using contrast in a region of captured image data
Application:
12/285,298 →
Publication:
US 2009/0095880
Nonvolatile Semiconductor Memory and Data Programming/Erasing Method
Semiconductor Device Having High Frequency Wiring and Dummy Metal Layer at Multilayer Wiring Structure
Multi-Valued Mask Rom
Autofocus Control Circuit, Autofocus Control Method and Image Pickup Apparatus
Manufacturing Method of Semiconductor Device Having Trench Isolation
Semiconductor Device and Method of Manufacturing the Same
Inverter Control Circuit and Control Method Thereof
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Fabricating Semiconductor Device
Nonvolatile Semiconductor Memory Device and Manufacturing Method Therefor
Data Processing Method of Decoding Coded Data and Data Processor for the Same
Semiconductor Device Having Spacer Formed on Semiconductor Chip Connected with Wire
Semiconductor Device
Method for driving liquid crystal display panel with triple gate arrangement
Application:
12/285,985 →
Publication:
US 2009/0102777
Semiconductor Integrated Device and Apparatus for Designing the Same
Semiconductor Intergrated Device and Apparatus for Designing the Same
Multiplier Circuit
Driving circuit for display apparatus
Application:
12/289,140 →
Publication:
US 2009/0102831
Semiconductor integrated circuit device
Application:
12/289,197 →
Publication:
US 2009/0102287
Method for designing semiconductor device layout and layout design supporting apparatus
Application:
12/289,198 →
Publication:
US 2009/0113374
Receiving circuit
Application:
12/289,259 →
Publication:
US 2009/0185628
Digital-To-Anolog Converter Circuit, Data Driver and Display Device
Semiconductor Device Having Two Bipolar Transistors Constituting Electrostatic Protective Element
Method and System for Manufacturing a Semiconductor Device Having Plural Wiring Layers
Semiconductor chip and semiconductor device with chip internal circuit element having component(s) both inside and outside of the chip seal ring
Application:
12/289,452 →
Publication:
US 2009/0121322
Power Supply Control Circuit Including Overvoltage Protection Circuit
Liquid crystal display, LCD driver, and operating method of LCD driver
Application:
12/289,454 →
Publication:
US 2009/0109211
Layout designing method for semiconductor device and layout design supporting apparatus for the same
Application:
12/289,490 →
Publication:
US 2009/0113370
Amplifier
Liquid Crystal Display Panel, Common Inversion Driving Method, Liquid Crystal Display Device, and Liquid Crystal Display Driver
Semiconductor Package and Semiconductor Device
Multi-domain display device
Application:
12/289,697 →
Publication:
US 2009/0195491
Receiving Circuit
Clamp ring for wafer and method of manufacturing semiconductor apparatus
Application:
12/289,740 →
Publication:
US 2009/0137096
Voltage-Current Converter and Voltage Controlled Oscillator
Communication Device
System-in-package
Application:
12/289,822 →
Publication:
US 2009/0140769
Attenuator
Application:
12/289,823 →
Publication:
US 2009/0134928
Semiconductor Device Including Hydrogen Barrier Film for Covering Metal-Insulator-Meal Capacitor and Method of Manufacturing the Same
Semiconductor Integrated Circuit
Semiconductor Device Having Dual Damascene Structure
Semiconductor Device Having Capacitor Formed on Plug, and Method of Forming the Same
Method of designing semiconductor device
Application:
12/292,202 →
Publication:
US 2009/0134495
Display Device and Display Driver with Output Switching Control
Processing System for Switching Between Execution of a Normal Task and a Management Task
Information Processing Apparatus and Method of Controlling Program Execution of Same
Semiconductor Device
Timer Unit Circuit Having Plurality of Output Modes and Method of Using the Same
Data Processing Apparatus and Method of Protecting a Peripheral Device in Data Processing Apparatus
Data Processing Device and Control Method for Preventing an Exception Caused by an Instruction Sent to a Peripheral Device by a Branch Source Program from Occurring During Execution of a Branch Destination Program or Interrupt Program
Manufacturing Method for Electronic Devices
Semiconductor Device and Method of Manufacturing the Same
Method and Apparatus for Manufacturing Semiconductor Module
Method of manufacturing wiring board, wiring board, and semiconductor device
Application:
12/292,434 →
Publication:
US 2009/0151986
Signal Generating Circuit
Semiconductor Device Including a Guard Ring Surrounding an Inductor
Logic simulator and logic simulation method
Application:
12/292,794 →
Publication:
US 2009/0144044
Layout design method of semiconductor integrated circuit by using soft macro
Application:
12/292,802 →
Publication:
US 2009/0144687
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2008
From: ARIYAMA, TAKEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021685/0093 →
Assignment of Assignor's Interest
Oct 15, 2008
From: ASAYAMA, SHINOBU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021686/0473 →
Assignment of Assignor's Interest
Oct 16, 2008
From: SATO, TAKAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021692/0407 →
Assignment of Assignor's Interest
Oct 16, 2008
From: MASUDA, TAKAFUMI; SERIZAWA, KENICHI; TAKAHASHI, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021690/0260 →
Assignment of Assignor's Interest
Oct 22, 2008
From: SUGISHITA, KYOSUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021721/0192 →
Assignment of Assignor's Interest
Oct 23, 2008
From: TAKAHASHI, HIROYUKI; NATSUME, HIDETAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021725/0173 →
Assignment of Assignor's Interest
Oct 24, 2008
From: TAKAHASHI, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021735/0028 →
Assignment of Assignor's Interest
Oct 24, 2008
From: KURITA, YOICHIRO; OUCHI, RIEKA; MIYAZAKI, TAKASHI; YAMADA, TOSHIYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021732/0891 →
Assignment of Assignor's Interest
Oct 27, 2008
From: SHIMIZU, JUNICHI; MITAMURA, KAZUHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021741/0099 →
Assignment of Assignor's Interest
Oct 31, 2008
From: SASAKI, TSUNEKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021769/0671 →
Assignment of Assignor's Interest
Nov 3, 2008
From: NAKASHIBA, YASUTAKA; TAKEWAKI, TOSHIYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021776/0841 →
Assignment of Assignor's Interest
Nov 4, 2008
From: MINAGAWA, TOMOHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021781/0679 →
Assignment of Assignor's Interest
Nov 5, 2008
From: TSUCHIDA, TOSHIYUKI; KOMATSU, YOSHIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021790/0280 →
Assignment of Assignor's Interest
Nov 6, 2008
From: KANBA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021797/0760 →
Assignment of Assignor's Interest
Nov 11, 2008
From: SHAO, MING
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021816/0857 →
Assignment of Assignor's Interest
Nov 12, 2008
From: SATO, KEISUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021821/0782 →
Assignment of Assignor's Interest
Nov 13, 2008
From: ISONO, TOSHIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021830/0930 →
Assignment of Assignor's Interest
Nov 17, 2008
From: NAGAHARA, SEIJI; HIROI, MASAYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021844/0566 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →