Manufacturing method for electronic devices

1. A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component, the manufacturing method comprising:

a first process for:

placing the first metallic bond part directly against the second metallic bond part;

applying pressure to the first electronic component and the second electronic component;

joining the first metallic bond part to the second metallic bond part with solid-phase diffusion; and

releasing the applied pressure; and

a second process for:

clamping the joined first electronic component and second electronic component by utilizing a clamping member; and

heating the clamped first electronic component and second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.

2. The manufacturing method for the electronic device according to claim 1 , wherein, in the second process, the clamping member applies pressure to multiple electronic components including the first electronic component and the second electronic component joined in the first process, in order to clamp the multiple electronic components.

3. The manufacturing method for the electronic device according to claim 2 , wherein an insulator layer is formed on a first surface of the first electronic component opposed to the second electronic component so as to expose the first metallic bond part,

wherein a gap is formed between the insulator layer and a second surface of the second electronic component opposed to the first electronic component when metallically joining the first metallic bond part to the second metallic bond part in the first process, and

wherein the insulator layer is placed in direct contact with the second surface and seals a periphery of the joined first metallic bond part and second metallic bond part after heating the clamped first electronic component and second electronic component in, the second process.

4. The manufacturing method for the electronic device according to claim 3 , wherein a thickness of the insulator layer is smaller than a total thickness value for the first metallic bond part and the second metallic bond part.

5. The manufacturing method for the electronic device according to claim 1 , wherein in the second process, resin serving as the clamping member is applied between opposing surfaces of the first electronic component and the second electronic component joined in the first process, so as to fix the first electronic component and the second electronic component.

6. The manufacturing method for the electronic device according to claim 1 , wherein the first electronic component comprises a wiring piece, and

wherein the second electronic component comprises a semiconductor chip.

7. The manufacturing method for the electronic device according to claim 6 ,

wherein the wiring piece is mounted on, a support piece, and

wherein the support piece is removed from the wiring piece after implementing the first process and the second process.

8. The manufacturing method for the electronic device according to claim 1 , the electronic device further comprising:

a third electronic component with a third metallic bond part; and

a fourth metallic bond part formed on an opposite surface of the second electronic component to a surface on which the second metallic bond part is formed, the manufacturing method comprising:

the first process, the first process further comprising:

placing the third metallic bond part in direct contact with the fourth metallic bond part;

applying pressure to the third electronic component and the second electronic component; and

releasing the pressure on the third electronic component and the fourth electronic component after the third metallic bond part was metallically joined to the fourth metallic bond part with solid-phase diffusion, and

the second process, the second process further comprising:

clamping the first electronic component, the second electronic component, and the third electronic component by utilizing the clamping member; and

heating the first electronic component, the second electronic component, and the third electronic component at a predetermined temperature.

9. The manufacturing method for the electronic device according to claim 1 , wherein the first process is implemented in air, and

wherein the second process is implemented in vacuum.

10. The manufacturing method for the electronic device according to claim 1 , wherein the first process is implemented in air, and

wherein the second process is implemented in a non-oxidizing gas atmosphere.

11. A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component, the manufacturing method comprising:

a first process for:

placing the first metallic bond part directly against the second metallic bond part;

applying pressure to the first electronic component and the second electronic component;

metallically joining the first metallic bond part to the second metallic bond part; and

releasing the applied pressure; and

a second process for:

clamping the joined first electronic component and second electronic component by utilizing a clamping member; and

heating the clamped first electronic component and second electronic component at a predetermined temperature so that the first metallic bond part and the second metallic bond part are melted and joined each other,

wherein the first electronic component or the second electronic component includes a semiconductor substrate and, the second metallic bond part mounted on the semiconductor substrate, and

wherein, the second metallic bond part includes a base section affixed on the semiconductor substrate and a cover section covering a surface of the base section with a melting point lower than that of the base section,

wherein in the first process, the first electronic component and the second electronic component are heated and maintained at a temperature lower than the melting point of the cover section, and

wherein in the second process, the first electronic component and the second electronic component are heated and maintained at a temperature higher than the melting point of the cover section.

12. The manufacturing method for the electronic device according to claim 11 , wherein in the first process, the cover section, and the first metallic bond part are joined by solid-phase diffusion.

13. The manufacturing method for the electronic device according to claim 11 , wherein in the second process, metal atoms that make up the base section diffuse into the cover section.

14. The manufacturing method for the electronic device according to claim 11 , wherein the cover section comprises tin (Sn) or indium (In), and

wherein the base section includes any of copper (Cu), nickel (Ni), gold (Au), or palladium (Pd).

15. The manufacturing method for the electronic device according to claim 11 , wherein the base section is bent to form an arc at tip surfaces.